Cinterion BGS3 Quad-band LGA module

Cinterion’s Evolution Platform is comprised of multiple Cinterion modules offering scalability, compatibility as well as an easy path to future upgrades and added functionality as technology needs expand. Portfolio benefits include maximum flexibility, high functionality, ease of integration, as well as backward and forward compatibility, which ensures a reliable, high quality and cost efficient solution that preserves your technology investment.

Part of the Evolution Platform, the LGA solderable products including the EES3 modules which feature efficient and  reliable LGA mounting technology along with optimized size and performance. The modules are based on a new advanced processor design and the field proven and reliable Cinterion M2M software stack. The latest chip technology enables high performance, improved efficiency and the benefit of long-term availability.

The BGS3 Wireless Module — Basic M2M functionality with GPRS Class 10 functionality, two serial interfaces, an integrated TCP/IP stack over AT and a RIL driver for Microsoft® Windows™ Mobile 6.1 based devices.