Cinterion BGS3

The Cinterion BGS3 is a compact LGA solderable wireless module designed for basic M2M connectivity applications. This quad-band GSM/GPRS module supports GPRS Class 10 functionality, delivering data speeds up to 86 kbps downlink and 43 kbps uplink. The module features an integrated TCP/IP stack accessible via AT commands, supporting internet services including TCP, UDP, HTTP, FTP, SMTP, and POP3.

The BGS3 includes two serial interfaces (ITU-T V.24 protocol) for device communication and features a RIL driver for Microsoft Windows Mobile 6.1 based devices. It supports both 3V and 1.8V SIM card interfaces, enabling compatibility with various SIM technologies from regular SIM cards to M2M component SIMs. The module incorporates Remote Link Stability (RLS) Monitoring for network performance information and Advanced Temperature Management to maintain reliability in critical thermal environments.

Operating within a voltage range of 3.2 to 4.5V and temperature range of -40°C to +85°C, the BGS3 measures 33.9 x 29.6 x 3.2 mm and weighs 5.5g. It supports standard GSM voice features including triple-rate codec (HR, FR, EFR), adaptive multi-rate (AMR), hands-free operation, echo cancellation, and noise reduction. Additional capabilities include SMS messaging, Group 3 Class 1 fax, and SIM Application Toolkit (release 99). The module comes with CE, R&TTE, GCF, UL, FCC, IC, and PTCRB certifications and is delivered in tape and reel packaging with 300 modules per reel for efficient automated manufacturing.

Download datasheet (PDF format)