Cinterion EGS3 is a highly advanced and compact embedded wireless module designed to provide reliable and secure machine-to-machine (M2M) communication. It supports a wide range of wireless bands and network standards, making it suitable for global deployment.
The Cinterion EGS3 module simplifies integration with its compact form factor and easy-to-use interface. It supports 2G (GSM/GPRS/EDGE) and 3G (UMTS/HSPA) wireless bands, enabling seamless connectivity in various regions around the world. This module also supports Quad-Band GSM and Tri-Band UMTS frequencies, providing flexibility and compatibility.
Key features of the Cinterion EGS3 include high data speed for fast and efficient communication, optimized power consumption for extended battery life, and advanced security mechanisms to ensure data privacy and protection. Furthermore, it offers reliable network connectivity even in challenging environments, thanks to its robust design and enhanced signal reception capabilities.
Overall, the Cinterion EGS3 is a versatile and reliable wireless module that caters to the needs of M2M applications, offering seamless connectivity, efficient data transfer, and secure communication.
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General features
- Control via AT commands
(Hayes 3GPP TS 27.007 and 27.005)
- GPRS multi-slot Class 12
- Circuit Switched Data Up to 14.4kbps
- SMS & Fax
- SIM Application Toolkit (release 99)
- TCP/IP stack access via AT commands
Internet services: TCP, UDP, HTTP, FTP, SMTP, POP3
- Supply voltage range: 3.2 … 4.5 V
- Operational temperature range: -40°C to +85°C
switch off: > +85°C
- Dimensions: 33.9 x 29.6 x 3.2 mm
- Weight: 5.5 g
Specification for GPRS Data transmission
- GPRS Class 12 & Class 10
Max. 86 kbps DL & UL
- Coding schemes CS 1-4
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Specification for voice
- Triple-rate codec for HR, FR, and EFR
- Adaptive multi-rate AMR
- Hands-free operation, Echo cancellation & Noise reduction
Special features
- Character framing 7E1 and 8E1 at serial interface
- SIM Access Profile integrated
- RLS Monitoring
- Advanced Temperature Management
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Interfaces (LGA pads)
- Antenna 50 Ω solder pad
- Audio: 2 x analog, 1 x digital
- 2x Serial interface (ITU-T V.24 protocol)
- SIM card interface 3V, 1.8V
- USB 2.0 full speed
- I²C & SPI bus
Approvals
- CE, R&TTE, GCF, UL, FCC, IC, PTCRB
- Local approvals and network operator certifications
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