The Telit LE910 MINI PCIE is a compact and versatile cellular module designed for Internet of Things (IoT) applications. It supports a wide range of wireless bands and network standards, making it suitable for global deployment. The module offers reliable and high-speed connectivity, enabling seamless communication between devices.
Key features of the Telit LE910 MINI PCIE include:
1. Multi-band support: The module supports various wireless bands, including LTE, HSPA+, and GSM/GPRS/EDGE, ensuring compatibility with different networks worldwide.
2. Network standards: It complies with global network standards, including 3GPP Release 9 and LTE Cat 1, providing a reliable and secure connection.
3. Compact design: With its mini PCIe form factor, the module can be easily integrated into a wide range of devices, making it ideal for space-constrained IoT applications.
4. Extended temperature range: The Telit LE910 MINI PCIE operates efficiently in extreme temperature conditions, ensuring reliable performance in harsh environments.
5. Enhanced features: The module offers advanced features such as voice support, GNSS (Global Navigation Satellite System) positioning, and integrated TCP/IP and UDP/IP stacks, enabling versatile IoT applications.
In summary, the Telit LE910 MINI PCIE is a reliable and compact cellular module that supports a wide range of wireless bands and network standards. With its advanced features and extended temperature range, it is an excellent choice for various IoT applications.
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Product features
Supported frequencies:
• EUG variant (European)
- LTE: 800 (B20) / 1800 (B3) / 2600 (B7)
- UMTS | HSPA: 900, 2100 MHz
• NAG variant (NA market – AT&T)
- LTE: 700 (B17) / 850 (B5) / AWS1700 (B4) / 1900 (B2)
- UMTS | HSPA: 850, 1900 MHz - GSM | GPRS | EDGE: 850, 1900 MHz
• NVG variant (NA market - Verizon)
- LTE: 700 (B13) / AWS1700 (B4)
- UMTS | HSPA: 850, 1900 MHz
• Embedded GPS | GLONASS receiver
• Rx Diversity and MIMO 2x2
• 3GPP release 9 compliant
• SIM application Tool Kits 3GPP TS 51.014
• Built in UDP / TCP / FTP / SMTP stack
• IP stack with TCP and UDP protocol
• Standard and extended AT command set
Data
LTE cat.3
• Uplink up to 50 Mbps
• Downlink up to 100 Mbpsps HSPA+
• Uplink up to 5.76 Mbps
• Downlink up to 42 Mbps
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Electrical & Sensitivity
• Output power -
Class 4 (2 W, 33 dBm) @ GSM 850 / 900
- Class 1 (1 W, 30 dBm) @ GSM 1800 / 1900
- Class E2 (0.5 W, 27 dBm) @ EDGE 850 / 900
- Class E2 (0.4 W, 26 dBm) @ EDGE 1800 / 1900
- Class 3 (0.25 W, 24 dBm) @ UMTS
- Class 3 (0.2 W, 23 dBm) @ LTE
• Supply voltage: 3.3 VDC +/- 9%
Environmental
• Dimensions:
- 51 x 30 x 3.2 mm
- 51 x 30 x 4.8 mm (with optional sim-holder)
• Weight: 10 grams
• Temperature range -40 to +85°C
• REACH and RoHS compliant
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Interfaces
• USB 2.0 HS
• USIM/SIM connection
– class B and class C
• SIM holder (option)
• DVI (Digital Voice Interface through the 52 pin edge connector)
• Wake
• W_Disable
• Led_wwan
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