The Telit LE910-EUG is a compact 4G LTE module designed for Internet of Things (IoT) applications. It supports a wide range of wireless bands and network standards to ensure global compatibility and seamless connectivity.
Key features of the Telit LE910-EUG include:
1. High-speed data transfer: With 4G LTE support, this module enables fast and reliable data transfer, ensuring quick response times and efficient communication.
2. Low power consumption: The Telit LE910-EUG is designed to operate with minimal power consumption, making it suitable for battery-powered IoT applications that require long-term operation.
3. Global coverage: This module supports a wide range of wireless bands and network standards, allowing for global coverage and compatibility with various cellular networks worldwide.
4. Embedded SIM: The Telit LE910-EUG features an embedded SIM, eliminating the need for external SIM cards and simplifying the deployment process.
5. Secure communication: The module incorporates advanced security features, including encryption and authentication protocols, to ensure secure and private communication between devices and the network.
Overall, the Telit LE910-EUG is a reliable and versatile 4G LTE module that offers high-speed data transfer, global coverage, low power consumption, embedded SIM functionality, and secure communication capabilities for IoT applications.
|
Product Features
- Market Europe and Australia
- LTE Upload (Mbps) 50
- LTE Download (Mbps) 100
- HSPA+ Upload (Mbps) 5.76
- HSPA+ Download (Mbps) 42.0
- Frequencies:
- LTE bands (MHz) 800 (B20) / 1800 (B3) / 2600 (B7)
- UMTS | HSPA+ bands (MHz) 850 (B5) / 900 (B8) / 2100 (B1)
- GSM | GPRS | EDGE bands (MHz) 900 / 1800
- Rx Diversity and MIMO DL 2x2
- Embedded GPS | GLONASS receiver
- SIM Access Profile
- LTE 3GPP release 9 compliant
- SIM application Tool Kits 3GPP TS 51.014
- Digital voice
- IP stack with TCP and UDP protocol
- Standard and extended AT command set
- e-Call compliant Data LTE
- Uplink up to 50 Mbps
- Downlink up to 100 Mbps HSPA+
- Uplink up to 5.76 Mbps
- Downlink up to 42.0 Mbps UMTS
- Uplink/Downlink up to 384 kbps
|
Data
LTE
• Uplink up to 50 Mbps
• Downlink up to 100 Mbps HSPA+
• Uplink up to 5.76 Mbps
• Downlink up to 42.0 Mbps UMTS
• Uplink/Downlink up to 384 kbps
Environmental
• Dimensions 28.2 x 28.2 x 2.2 mm
• Temperature Range -40°C to +85°C
• REACH and RoHS compliant Interfaces
• 144-pin LGA
Interface
• 10 I/O ports including multifunctional I/Os
• USB 2.0 HS • UART
• 1.8 V / 3 V SIM interface
• RF pad, RX Div. & MIMO pad, GNSS Antenna pad
|
Approvals
• CE, GCF (Europe)
• FCC, PTCRB, IC (North America)
• KCC (Korea)
Electrical & Sensitivity
• Output power
- Class 4 (2 W, 33 dBm) @ GSM 850 / 900
- Class 1 (1 W, 30 dBm) @ GSM 1800 / 1900
- Class E2 (0.5 W, 27 dBm) @ EDGE 850 / 900
- Class E2 (0.4 W, 26 dBm) @ EDGE 1800 /1900
- Class 3 (0.25 W, 24 dBm) @ UMTS
- Class 3 (0.2 W, 23 dBm) @ LTE
• Supply voltage
- Nominal: 3.8 VDC
- Range: 3.3 - 4.2 VDC
|
