Part no.: L30960-N3000-A310
Manufacturer: Thales Gemalto Cinterion
Availability: In Stock
The new Cinterion AHS3 flagship HSPA+ module for automotive applications is optimized for high quality audio support and high bandwidth connectivity allowing speeds up to 14.4 Mbps for downlink and 5.7 Mbps for uplink. The solderable platform offers true global 3G coverage in two cost-optimized variants for improved Total Cost of Ownership: AHS3-US and AHS3-W.
AHS3 is engineered to meet the highest level of compliance with automotive specifications and provides an unparalleled level of quality and performance, even under the harshest operating conditions.
The unique Cinterion Land Grid Array (LGA) technology enables optimized heat dissipation that prevents warping. It gives our automotive customers the freedom to select the most beneficial soldering paste for each individual application.
Based on Qualcomm’s latest chipset, the module’s extreme ruggedness and ultra compact LGA footprint guarantee long product availability and a reliable migration path to Long Term Evolution (LTE), critical as 4G technology becomes imperative to support future data-intensive services in automotive entertainment systems.
Equipped with high performance GPS/GLONASS, the AHS3 platform is already prepared to meet the comprehensive requirements of the European eCall and ERA-GLONASS initiatives. It also features in-band modem functionality, voice prompts, high quality audio according to VDA 2a, jamming detection, antenna diagnosis as well as TCP/IP services.
The AHS3 is an ideal enabler for current and future high performance automotive and ITS applications including: toll collect, onboard vehicle telematics and fleet management, in-car entertainment systems as well as automatic emergency calling, breakdown support or roadside assistance.
GENERAL FEATURES
SPECIFICATIONS
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SPECIAL FEATURES
GPS/GLONASS FEATURES
INTERFACES (SMT-LGA)
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DRIVERS
APPROVALS
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Part no.: L30960-N3000-A310
Manufacturer: Thales Gemalto Cinterion